First, what is bonding?
Bonding, that is, chip bonding, chip coating, also known as bonding. Bonding is a kind of wire bonding method in the chip production process. Generally, the internal circuit of the chip is connected with the package pin by the gold wire before the package is mounted. After the bonding (that is, after the circuit and the pin are connected), the chip is packaged with a black colloid. At the same time, the advanced package technology COB (Chip On Board) is adopted. The process of the process is to implant the tested wafer onto a special circuit board, and then connect the wafer circuit to the circuit board with a gold wire. The organic material with special protection function after melting is covered on the wafer to complete the post-packaging of the chip.
Second, bonding technology advantages
1, bonding chip anti-corrosion, anti-seismic, stable performance
The advantage of this package is that the stability of the finished product is much higher than that of the conventional SMT chip. Because the SMT chip technology used in many applications is to solder the chip pins on the circuit board, this production process is not very good. Suitable for the processing of mobile storage products, there are problems of soldering, false soldering, and leakage soldering in the package test. In the daily use process, the solder joints on the circuit board are exposed to the air for a long time, exposed to moisture, static electricity, physical wear, Natural and human factors such as micro-acid corrosion cause the product to be prone to short circuit, open circuit, or even burnt. The bonding chip connects the internal circuit of the chip to the board package pin through the gold wire, and then precisely covers it with the organic material with special protection function to complete the later package. The chip is completely protected by the organic material and is isolated from the outside without moisture. At the same time, the organic material melts through the high temperature, covers the chip and is dried by the instrument, and seamlessly connects with the chip, completely eliminating the physical wear of the chip and achieving higher stability.
2, bonding chip for mass production
The bonding technology is currently only mastered by a few large fabs, and the number of open films should be at least 100,000 or even higher. The production process is safe and stable, there is almost no product quality problem, and the product has strong consistency and long service life. Therefore, large manufacturers with technical strength will use this advanced but high-cost production process to process high-end products.
Third, the application of bonding technology
In fact, bonding technology has been widely used in our side, such as mobile phones, PDAs, MP3 players, digital cameras, game consoles and other devices LCD screen, many are using bonding technology. Therefore, the purchase of products from international manufacturers after bonding, relatively good quality, performance and specifications are better. On equipments with higher running frequencies and higher requirements for shielding electromagnetic interference, it is difficult to avoid some technical hazards by using traditional packaging methods. Bonding technology is an effective solution.
common types include sjt, svt, seow, sj
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