The company is mainly engaged in integrated circuit packaging and discrete device production. As the semiconductor industry continues to boom, the company's integrated circuit packaging and discrete device manufacturing sales are booming. The company expects net profit attributable to shareholders of listed companies for the year 2010 to increase by 760 compared with the same period last year. %-800%.
Looking into the future, the company has begun to enter a stage of high-speed growth. The main aspects are:
1. Leading technology and successful entry into the global giant's global procurement chain. The company has mastered the high-end technology of integrated circuit packaging, especially WLCSP, RDL, Sip, FBP, MIS, and Re. X packaging technology, in which RF-SIM cards, MSD cards, MEMS and other packaging products manufactured using Sip's high-end packaging technology have been successfully mass-produced and entered the global procurement chain of international giants such as Fairchild, ON Semiconductor and ADI. It laid the foundation for the rapid growth of the company.
2. The production capacity enters the peak release period. The company's annual output of 1.065 billion thin-type chip circuit seal test production line project will be completed and put into production in 2010, and it will enter the peak period of the capacity release period in 2011.
3, allotment financing to resolve financial pressures. In October 2010, the successful allotment financing resulted in a significant improvement in the capital structure and reduced the financial resistance of the company's future development.
In the secondary market, the stock has recently rebounded on the small Yangxian line, and the stock price has returned to the top of the year line. The volume can continue to moderately increase. The market outlook is expected to continue to rebound under the support of the year line, and may wish to pay attention to Changfeng Electronics Technology (600584). (CORE Investment Li Huihong)
Looking into the future, the company has begun to enter a stage of high-speed growth. The main aspects are:
1. Leading technology and successful entry into the global giant's global procurement chain. The company has mastered the high-end technology of integrated circuit packaging, especially WLCSP, RDL, Sip, FBP, MIS, and Re. X packaging technology, in which RF-SIM cards, MSD cards, MEMS and other packaging products manufactured using Sip's high-end packaging technology have been successfully mass-produced and entered the global procurement chain of international giants such as Fairchild, ON Semiconductor and ADI. It laid the foundation for the rapid growth of the company.
2. The production capacity enters the peak release period. The company's annual output of 1.065 billion thin-type chip circuit seal test production line project will be completed and put into production in 2010, and it will enter the peak period of the capacity release period in 2011.
3, allotment financing to resolve financial pressures. In October 2010, the successful allotment financing resulted in a significant improvement in the capital structure and reduced the financial resistance of the company's future development.
In the secondary market, the stock has recently rebounded on the small Yangxian line, and the stock price has returned to the top of the year line. The volume can continue to moderately increase. The market outlook is expected to continue to rebound under the support of the year line, and may wish to pay attention to Changfeng Electronics Technology (600584). (CORE Investment Li Huihong)
Jiangxi Huayang New Energy Co.,Ltd , https://www.huayangenergy.com