Overview:
This paper designs and implements a new high PSRR, low TC bandgap reference source. The focus is on the bandgap reference source power supply rejection capability, especially the high frequency PSRR, which achieves the high performance specification of the PSRR in the wide frequency range. The simulation is carried out in a 0.35 μm BiCMOS process. The results show that the PSRR reaches -108.5 dB at 1 Hz and -58.9 dB at 15 MHz. The second-temperature drift compensation circuit makes the bandgap reference source output a reference voltage of 1.183 V at room temperature. The temperature drift coefficient is as low as 1.5 ppm/°C in the temperature range of -40 °C to 95 °C.
Bandgap reference sources are an important part of analog integrated circuits and digital-analog hybrid integrated circuits. As the operating frequency of the SoC continues to increase, some high-speed digital circuits and noise-sensitive analog (or RF) circuits within the chip have higher and higher requirements for the high-frequency rejection of the reference voltage. Design a wideband high power supply rejection ratio (PSRR), low temperature drift TC (Temperature Coefficient), and a small bandgap reference source BGR (Bandgap) for internal circuit use is the SoC power management system. The essential.
The power supply voltage often has about 10% fluctuations and noise interference. The function of the BGR is to provide a stable reference voltage that is less affected by temperature drift, and this voltage has sufficient suppression of fluctuations and noise at the power supply end. The traditional BGR has poor power supply rejection capability in the high frequency band (above 100 kHz). For this reason, the BGR output reference voltage is effectively isolated from the power supply voltage by the path of BGR power supply rejection, and the broadband voltage is high. Performance requirements for power supply rejection ratios. In SoC applications, level shifting, data conversion circuits, and other RF circuits impose lower temperature drift coefficients on BGR. Therefore, the low temperature drift coefficient has become the most research index of most BGR related papers, and the second, third and even higher temperature drift compensation circuits emerge one after another. Representative examples include exponential compensation method [1], linear compensation method [2] ], different material resistance compensation method [3] and so on. This paper proposes a PTAT2 (Positive Temperature Coefficient) current generation circuit, which compensates for temperature drift twice, has a simple circuit structure, and can achieve a smaller temperature drift coefficient with a wide temperature variation range BGR.
(Please read the PDF for details)
1.ANTENK Wire to Board connectors are avialable in different terminations and sizes intended for use on a variety of applications. These connectors provide power and signal with different body styles, termination options, and centerlines. To find the wire to board set required, click on the appropriate sub section below.
2.Our products are widely used in electronic equipments,such as monitors ,electronic instruments,computer motherboards,program-controlled switchboards,LED,digital cameras,MP4 players,a variety of removable storage disks,cordless telephones,walkie-talkies,mobile phones,digital home appliances and electronic toys,high-speed train,aviation,communication station,Military and so on
Antenk Wire To Board Connectors Ranges:
Power Wire to Board
IDC Wire to Board
Locking Wire to Board
Latching Wire to Board
Fine Pitch Wire to Board
Wire to Board Connectors Information
Description
Wire-to-board connectors are used to interconnect printed circuit boards (PCBs) by using connectors attached to wires.
Specifications
Specifications for a wire to board connector include the following.
Wire-entry angle - There are three wire-entry angle styles: vertical, right-angle, and bottom-entry.
Wire size - Wire size is usually measured in American wire gauge (AWG), a standard for non-ferrous wire conductor sizes. The term "gauge" refers to the wire`s diameter. The higher the gauge number, the smaller the diameter and the thinner the wire.
Circuits or positions - With wire to board connectors, the number of circuits or positions may range from 1 to 120.
Pitch or center spacing - Pitch or center spacing is measured in millimeters (mm) or inches.
Lock to mating style - There are three basic lock-to-mating styles: positive, friction, and friction ramp.
Maximum current - The maximum current or current-carrying capacity is measured in amperes (A) and ranges from 1.0 A to 50. A.
Termination Methods
Crimp is the physical compression of a contact wire around a conductor to make an electrical and mechanical connection. Insulation displacement connectors (IDC) slice through the cable insulation to make a connection. Choices for termination method also include cage clamp, screw, tabs, and solder cups.
PCB Mounting Styles
With wire to board connectors, there are four choices for PCB mounting.
Through-hole technology (THT) mounts components on a PCB by inserting component leads through holes in the board and then soldering the leads in place on the opposite side of the board.
Surface mount technology (SMT) adds components to a PCB by soldering component leads or terminals to the top surface of the board. SMT components have a flat surface that is soldered to a flat pad on the face of the PCB. Typically, the PCB pad is coated with a paste-like formulation of solder and flux.
Press-fit and compression-style Board To Board Connectors are also commonly available.Wire to Board Connectors Information
Standards
Wire-to-board connectors carry approvals from various national and international organizations. In North America, they often bear marks from Underwriters Laboratories (UL) and/or the Canadian Standards Association (CSA).
A wire to board connector for the European marketplace should comply with the Restriction of Hazardous Substances (RoHS) and Waste Electrical and Electronic Equipment (WEEE) directives from the European Union (EU). Wire-to-board connectors that comply with other requirements are also available.
BS 9526 N0001 - Specification for multi-contact edge socket electrical connectors.
Wire To Board Connectors,Wire Harness,Pcb Wire To Board Connector,Pin Wire To Board Connector,IDC Wire to Board,Locking Wire to Board,Latching Wire to Board,Fine Pitch Wire to Board
ShenZhen Antenk Electronics Co,Ltd , https://www.antenksocket.com